Ntchito Zazikulu ndi Mtengo Waukulu wa Ufa Wa Diamondi Wopangidwa Mwaluso Kwambiri/Wosalala Kwambiri
Ufa wa diamondi wolondola kwambiri komanso wosalala kwambiri, monga kugawa kwa tinthu tating'onoting'ono kolimba kwambiri, kowala kwambiri, komanso kowongoleredwa kwambiri komwe kulipo pakadali pano, ukukhala chinthu chofunikira kwambiri popanga zinthu molondola. Chifukwa cha kufunikira kwakukulu kwa mtundu wa pamwamba, kulondola kwa kukonza, komanso kudalirika kwa zinthu kuchokera kumakampani monga kuwala, zamagetsi, ma semiconductor, ndi mphamvu zatsopano,ufa wa diamondiikusintha kuchoka pa kupukuta ndi kupukuta kwachikhalidwe kupita ku kupanga kolondola kwambiri, ndipo kuchuluka kwa momwe imagwiritsidwira ntchito kukukulirakulira. Tinthu ta diamondi micropowder nthawi zambiri timakhala pakati pa 0.1–10 μm, ndipo ufa wa submicron ndi nano-sized ultrafine umakhala wofunikira kwambiri popanga zinthu zapamwamba. Ali ndi kuuma kwakukulu kwa Mohs 10, kutentha kwambiri, kusinthasintha kochepa, komanso kuthekera kodula pang'ono komwe kumapangidwa panthawi yokonza, zomwe zimapangitsa kuti pamwamba pa atomu pazida zokonzedwa. Izi zimawonekera makamaka mu gawo lomaliza la kupukuta la magalasi optical, safiro, ziwiya zadothi, makristalo a laser, ma wafer a semiconductor, ndi zitsulo zolimba kwambiri, komwe zimasonyeza ubwino wosasinthika.
Mu gawo la optics ndi lasers,ufa wa diamondi wabwino kwambiriimagwiritsidwa ntchito makamaka popukuta magalasi owoneka bwino kwambiri, makristalo a infrared, mawindo a safiro, magalasi owunikira kwambiri, ndi makristalo a laser. Makampani opanga ma optics amafuna kukhwima kwambiri pamwamba, nthawi zambiri kumafuna Ra < 1 nm. Mphepete zakuthwa za ufa wa diamondi, zomwe zimagwira ntchito mopanda kuwonongeka, zimachepetsa bwino zigawo zopsinjika ndi mikwingwirima, ndikuwonjezera kufalikira kwa kuwala ndi magwiridwe antchito a kuwala. Pokonza magalasi a foni ya safiro, mawindo a infrared, zosefera zolumikizirana, ndi magalasi a laser resonator, slurries zopukuta diamondi, ma diamondi opukuta, ndi ma diamondi suspensions ndizofunikira kwambiri. Kuphatikiza apo, ufa wa ultrafine umagwiritsidwanso ntchito mu njira za MRF (magnetorheological rheological polishing) ndi CMP (chemical mechanical polishing). Kudzera muukadaulo wolondola wa tinthu tating'onoting'ono komanso ukadaulo wokutira pamwamba, kudula kofanana ndi kupukuta kotsika kumachitika, zomwe zimapangitsa kuti magwiridwe antchito azigwira bwino ntchito komanso kukolola kwa zinthu zowala.
Mu makampani opanga ma semiconductor ndi zamagetsi, ufa wa diamondi wolondola kwambiri umagwiritsidwa ntchito popera ndi kupukuta ma wafer a silicon, silicon carbide (SiC), gallium nitride (GaN), ma substrates a safiro, ndi ma wafer a semiconductor. Chifukwa cha kukula kwakukulu kwa zida zamagetsi za SiC ndi makampani opanga ma semiconductor a m'badwo wachitatu, kuuma kwakukulu ndi kusweka kwa ma wafer kumapangitsa kuti zinthu zogwiritsidwa ntchito zigwiritsidwe ntchito kwambiri. Ufa wa diamondi wochepa umatha kuchotsa zinthu mwachangu panthawi yopera ndikuchepetsa kukhwima kwa pamwamba pa nanometer panthawi yopera, kuchepetsa kuwonongeka kwa pamwamba motero kumawonjezera mphamvu ya chipangizo ndi kutentha. Mu makampani opanga ma panel owonetsera, ufa wa diamondi wochepa umagwiritsidwa ntchito kwambiri popera bwino kwambiri ma glass cover, ma wotchi, magalasi ophimba a 3D, ndi AR/VR optical components. Kugwiritsa ntchito kwake bwino kwambiri kumatha kufupikitsa nthawi yopangira, kusintha kusinthasintha kwa zinthu, ndikuwonjezera kwambiri nthawi yopangira komanso nthawi yozungulira.
M'magawo olimba kwambiri monga carbide yopangidwa ndi simenti, zoumbaumba, ndi zitsulo zopangidwa ndi matrix, ufa wa diamondi wopyapyala kwambiri umagwiritsidwa ntchito kwambiri popera m'mphepete mwa zida molondola, kupukuta bwino nkhungu, kulimbitsa pamwamba pa zida zomangira ndege, komanso kupanga bwino. Ngakhale zida za carbide zopangidwa ndi simenti zimatha kupititsa patsogolo kukana kuwonongeka ndi kudula moyo wotsalira pambuyo pa kusuntha ndi kupukuta,ufa wa diamondi imatha kudula pang'ono pamene ikusunga kuthwa, zomwe zimapangitsa kuti kapangidwe kake kakhale kofanana komanso kozungulira. Mu makampani opanga nkhungu molondola, monga nkhungu zolowetsa jekeseni, nkhungu zoponyera, ndi nkhungu zowala, kupukuta ufa wa diamondi micron kumatha kukhala ndi zotsatira zofanana ndi galasi, kusintha kwambiri moyo wa nkhungu, kuyeretsa magwiridwe antchito, komanso mtundu wa nkhungu. Mumakampani opanga magalimoto, ndege, ndi zida zamagetsi, ufa wa diamondi micron umagwiritsidwanso ntchito popera zinthu zina zapadera molondola kwambiri, monga zigawo zolimba za ceramic turbine, superalloys zochokera ku nickel, ndi carbon fiber composites, zomwe zimapangitsa kuti zigawozo zikhale zodalirika komanso zokhazikika.
Pamene minda yogwiritsira ntchito ikupitilira kukula, ukadaulo wokonzekera ufa wa diamond micron wolondola kwambiri ukukonzedwanso nthawi zonse. Pakadali pano, njira zazikulu zokonzekera zikuphatikizapo kuphwanya diamondi yopangira mwamphamvu kwambiri, kuphulika (nanodiamondi), njira zamakemikolo, ndi njira zosinthira pamwamba. Kuti akwaniritse zofunikira zapamwamba za kukhazikika ndi kuyimitsidwa m'mafakitale a optics ndi semiconductor, ufa wa micron wapamwamba nthawi zambiri umakutidwa, monga zitsulo, zinthu zosapangidwa, zachilengedwe, ndi ma surfactants, motero zimawonjezera kufalikira, kukana kutentha, komanso kusinthasintha kwa ntchito. Daimondi yokhala ndi miyala yopyapyala pang'onopang'ono ikusintha malo achikhalidwe.zipangizo zopukutiramonga cerium oxide ndialuminiyamuMu njira za CMP, zomwe zimapangitsa kuti ma wafer ndi zida zowunikira zikhale zosalala komanso zogwira ntchito bwino. M'tsogolomu, ndi chitukuko cha kupanga zinthu mwanzeru, kulumikizana kwa quantum, zida zamankhwala zolondola komanso zida zamakono zamagetsi, ufa wa diamondi wolondola kwambiri upitiliza kukulitsa malire ake ogwiritsira ntchito ndikukhala chinthu chofunikira kwambiri pamakampani opanga zinthu.